SMP
SMP
Primary Technical Characteristics
Elecreical Performance | Material and Mechanical Performance | |||||
---|---|---|---|---|---|---|
Characteristic Impedance | 50Ω | Center Contact | Pin | Beryllium Copper | Gold Plating | |
Frequency Range | DC~26.5GHz | Socket | Beryllium Copper | Gold Plating | ||
Rated Voltage | 335V rms | Body and Other Metal Parts | Brass/Stainless Steel | Gold plating / Passivation | ||
Dielectric Strength Voltage | 500V rms | Elastic Part | Beryllium Copper | Gold Plating | ||
VSWR | ≤1.10 | DC~3GHz | Insulator | Unthreaded Hole | PTFE | |
≤1.15 | 3GHz~6GHz | Meshing Force & separating force | Half Escapement | 9N max | 2.2N | |
≤1.30 | 6GHz~26.5GHz | Escapement | 45N max | 9N min | ||
Contact Resistance | ≤6.0mΩ | Center Contact | Unthreaded Hole | 68N max | 22N min | |
≤2.0mΩ | Outer Contact | Durability | Half Escapement | 1000次 | ||
Insulation Resistance | ≥5000MΩ | Escapement | 500次 | |||
Insertion Loss | ≤0.05√f(GHz)dB | 100次 |
Model
Part Number | Pin(Diameter) | Notes |
---|---|---|
SMP-KFD1 | 0.30 | |
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